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Sales and Corporate Office
1717 Chicago Avenue
Riverside, California 92507-2364
Phone: (951) 788-1700
Fax: (951) 369-1151
Applications Engineering
17271 North Umpqua Hwy.
Roseburg, Oregon 97470-9422
Phone: (541) 496-0700
Fax: (541) 496-0408
e-mail: • web: www.caddock.com
For Caddock Distributors listed by country see caddock.com/contact/dist.html
© 2004 Caddock Electronics, Inc.
CADKDOC
CC1512FC Standard Resistance Values:
Tolerance CC1512FC ±1% Standard (except as noted).
CC2015FC Standard Resistance Values:
Tolerance CC2015FC ±1% Standard (except as noted).
CC2520FC Standard Resistance Values:
0.010 Ω 5%
0.015 Ω 5%
0.020 Ω 5%
0.025 Ω 5%
0.030 Ω 5%
Tolerance CC2520FC ±1% Standard (except as noted).
0.033 Ω 5%
0.040 Ω 5%
0.050 Ω 2%
0.075 Ω 2%
0.10 Ω
0.15 Ω
0.20 Ω
0.25 Ω
0.30 Ω
0.33 Ω
0.40 Ω
0.50 Ω
0.75 Ω
1.00 Ω
1.50 Ω
2.00 Ω
2.50 Ω
3.00 Ω
0.010 Ω 5%
0.015 Ω 5%
0.020 Ω 5%
0.025 Ω 5%
0.030 Ω 5%
0.033 Ω 5%
0.040 Ω 5%
0.050 Ω 2%
0.075 Ω 2%
0.10 Ω
0.15 Ω
0.20 Ω
0.25 Ω
0.30 Ω
0.33 Ω
0.40 Ω
0.50 Ω
0.75 Ω
1.00 Ω
1.50 Ω
2.00 Ω
2.50 Ω
3.00 Ω
0.020 Ω 5%
0.025 Ω 5%
0.030 Ω 5%
0.033 Ω 5%
0.040 Ω 5%
0.050 Ω 2%
0.075 Ω 2%
0.10 Ω
0.15 Ω
0.20 Ω
0.25 Ω
0.30 Ω
0.33 Ω
0.40 Ω
0.50 Ω
0.75 Ω
1.00 Ω
1.50 Ω
2.00 Ω
2.50 Ω
3.00 Ω
3.30 Ω
4.00 Ω
5.00 Ω
7.50 Ω
8.00 Ω
10.0 Ω
Custom resistance values and non-standard tolerances can be manufactured for high quantity applications. Please contact Caddock Applications Engineering.
Recommended Circuit Board Layout
(current and sense connections):
Fig. 1A: Kelvin layout recommended for values below 0.20Ω
Fig. 1B: Kelvin layout
recommended for higher resistance values.
T*e CC Low Resistance Precision Chip Resistors
Style FC - Flip Chip Version is a surface mount version with solderable pads for flip chip soldering.
Note 1: General Applications - The power rating
for general applications is based upon 0.5 sq. in. (300 mm2) of termination pad or trace area (2 oz. copper) connected to each end of the resistor. Maximum chip temperature is 150°C. Use Derating Curve to derate appropriay for the maximum ambient temperature and for the temperature limitations of the adjacent materials.
Note 2: Thermal Resistance - In High Power Applications where the circuit board
material provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of the chip resistor is useful to establish the maximum power capability of the chip resistor in the application. The film temperature is measured at the center of the
resistor element and the solder pad temperature is measured at the center of the
termination pad (point X in the recommended circuit layouts shown below). Maximum
temperature of the chip resistor (at the center of chip) should not exceed 150°C through the temperature range of the application.
Style FC Derating Curve For General Applications
3.30 Ω
4.00 Ω
5.00 Ω
7.50 Ω
8.00 Ω
10.0 Ω
3.30 Ω
4.00 Ω
5.00 Ω
7.50 Ω
8.00 Ω
10.0 Ω
S
SXXCCCXXSSCC
C = Current connection
S = Sense connection
Note: Actual width of current trace is based on magnitude of current. Point of connection should be in the area shown.
0.015
Ω0.010 ΩModelResistanceMin.Max.Power Capability InformationCC1512FCCC2015FCCC2520FC10.0 Ω0.020 Ω10.0 Ω0.020 Ω10.0 Ω0.020 Ω0.010 Ω0.025 Ω150°C0.75 WattMax. ChipTemperatureGeneral ApplicationsHigh Power ApplicationsThermal Resistance - RθJCFilm (J) to Solder Pad (C)(see note 2)22.7°C/WattPower Ratingat 70° C(see note 1)22.7°C/Watt16.0°C/Watt13.0°C/Watt11.5°C/Watt150°C150°C150°C150°CDimensions in inches and (millimeters).150 ±.007(3.81 ±.18)ABD.120 ±.007(3.05 ±.18).035 min.(0.89 min.)C.027 ±.005(.69 ±.13).250 ±.007(6.35 ±.18).200 ±.007(5.08 ±.18).065 min.(1.66 min.).032 ±.005(.81 ±.13).250 ±.007(6.35 ±.18).200 ±.007(5.08 ±.18).040 min.(1.02 min.).041 ±.004(1.04 ±.10).200 ±.007(5.08 ±.18).150 ±.007(3.81 ±.18).050 min.(1.27 min.).027 ±.003(.69 ±.08).150 ±.007(3.81 ±.18).120 ±.007(3.05 ±.18).035 min.(0.89 min.).022 ±.003(.56 ±.08)CommentsSolder Coated PadsSolderable PadsSolderable PadsSolder Coated PadsSolderable Pads0.75 Watt1.0 Watt1.5 Watts1.5 WattsA*ENT TEMPERATURE, CRATED LOAD, %
o
• Style FC - Flip Chip version for surface mount applications.
Style WB - Wire Bond version for hybrid applications with metallized back
surface for solder down heat sinking of the chip, includes bondable termination
pads to receive aluminum wire bonds.
• Thermal resistance is provided to optimize high power designs when utilizing
higher thermal conductivity circuit board substrates such as IMS or Alumina.
• Resistance range down to 0.010 ohm at ±5%, 0.050 ohm at ±2%,
and 0.10 ohm at ±1%.
• Low inductance provides excellent high frequency and pulse response.
• High pulse handling and overload capability.
• Best choice for switching power supplies, motor speed controls, and high
current sensing applications.
Page 1 of 2
28_IL106.1004
Sales and Corporate Office
1717 Chicago Avenue
Riverside, California 92507-2364
Phone: (951) 788-1700
Fax: (951) 369-1151
Applications Engineering
17271 North Umpqua Hwy.
Roseburg, Oregon 97470-9422
Phone: (541) 496-0700
Fax: (541) 496-0408
e-mail: • web: www.caddock.com
For Caddock Distributors listed by country see caddock.com/contact/dist.html
© 2004 Caddock Electronics, Inc.
CADKDOCCC 2520 FC - 0.10 - 1%T*e CCPhysical Size1512 = 0.150” x 0.120”2015 = 0.200” x 0.150”2520 = 0.250” x 0.200”Style:FC or WBResistor Value (Ω)See charts for availabilityTolerance:± 5% below 0.050Ω± 2% 0.050Ω to 0.099Ω± 1% 0.10Ω and above
Specifications:
Temperature Coefficient: TC referenced to +25°C, ΔR taken at +150°C.
0.50 ohm and above, -20 to +80 ppm/°C
0.050 ohm to 0.49 ohm, 0 to +200 ppm/°C
below 0.050 ohm, 0 to +300 ppm/°C.
Inductance: Less than 5 nH t*ical.
Load Life: 1000 hours at rated power, based upon 150°C max. chip temperature,
ΔR ± (0.5% + 0.0005 ohm).
Momentary Overload: 1.5 times rated power, for 5 seconds, ΔR ± (0.5% + 0.0005 ohm).
Operating Temperature: -55°C to +150°C.
Measurement Note: All measurements are taken using Kelvin connections per the
recommended connection locations.
Ordering
Information:
Ko signifies tape thickness and dimension
12mm0.473”AoBo7” dia.(178 mm).512” arbor hole(13mm)
Packaging information:
Style FC, flip chip resistors, are shipped with the bare
ceramic side up in the pocket, with the solderable pads fac-
ing down.
Style WB, wire bondable resistors, are shipped with the
wire bondable pads facing up in the pocket.
The illustration shows the orientation of the CC1512 and
CC2015 chip resistors in the tape. The CC2520 chip resistors
are rotated 90° from what is shown in the illustration.
0.135” (3.43mm)
Carrier Tape and pocket dimensions:Tape is 12mm Carrier Tape (8mm pitch)0.167” (4.24mm)0.037” (0.94mm)0.189” (4.80mm)Size 20150.209” (5.31mm)0.087” (2.21mm)0.271” (6.88mm)Size 25200.216” (5.49mm)0.066” (1.68mm)AoBoKoSize 1512
Full reel quantities:
1500 pieces per reel for CC1512
1000 pieces per reel for CC2015 and CC2520
Quantities of less than 250 will be shipped in tape without reel and without tape leader at the option of Caddock.
Tape dimensions and materials will be consistent with EIA-481-1. Reels will be marked with a label containing Caddock logo, part number, resistor value, tolerance, packaging date, and quantity.
CC2015WB Standard Resistance Values:
Tolerance CC2015WB ±1% Standard (except as noted).
CC2520WB Standard Resistance Values:
0.025 Ω 5%
0.030 Ω 5%
0.033 Ω 5%
0.040 Ω 5%
Tolerance CC2520WB ±1% Standard (except as noted).
0.050 Ω 2%
0.075 Ω 2%
0.10 Ω
0.15 Ω
0.20 Ω
0.25 Ω
0.30 Ω
0.33 Ω
0.40 Ω
0.50 Ω
0.75 Ω
1.00 Ω
1.50 Ω
2.00 Ω
2.50 Ω
3.00 Ω
3.30 Ω
4.00 Ω
5.00 Ω
7.50 Ω
8.00 Ω
10.0 Ω
0.020 Ω 5%
0.025 Ω 5%
0.030 Ω 5%
0.033 Ω 5%
0.040 Ω 5%
0.050 Ω 2%
0.075 Ω 2%
0.10 Ω
0.15 Ω
0.20 Ω
0.25 Ω
0.30 Ω
0.33 Ω
0.40 Ω
0.50 Ω
0.75 Ω
1.00 Ω
1.50 Ω
2.00 Ω
2.50 Ω
3.00 Ω
3.30 Ω
4.00 Ω
5.00 Ω
7.50 Ω
8.00 Ω
10.0 Ω
Custom resistance values and non-standard tolerances can be manufactured for high quantity applications. Please contact Caddock Applications Engineering.
Style WB - Wire Bond Version
Model
ResistanceMin.Max.Power Capability InformationCC2015WBCC2520WB10.0 Ω10.0 Ω0.020 Ω0.025 ΩMax. ChipTemperatureThermal ResistanceRθJCFilm (J) to Solder Pad (C)(see note 3)13.9°C/Watt8.33°C/Watt150°C150°CDimensions in inches and (millimeters)ABDC.250 ±.007(6.35 ±.18).200 ±.007(5.08 ±.18).040 min.(1.02 min.).200 ±.007(5.08 ±.18).150 ±.007(3.81 ±.18).050 min.(1.27 min.).027 ±.003(.69 ±.08)CommentsAluminum wire to be used for bonding.027 ±.003(.69 ±.08)Aluminum wire to be used for bonding
Note 3: Thermal Resistance - In High Power Applications where the circuit board material provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of the chip resistor is useful to establish the maximum power capability of the chip resistor in the application. The film temperature is measured at the center of the resistor element and the solder pad temperature is measured at the soldered interface with the circuit board. Maximum temperature of the chip resistor (at the center of chip) should not exceed 150°C through the temperature range of the application.WB Resistor mountingCircuit board: IMS, Ceramic (Alumina) , or other.Sense WireCurrent WireFilm TemperatureMeasuring PointSolder pad, solderedinterface with circuit board.Sense WireCurrent Wire
Sense connection shall be made in the crosshatched portion of the termination
pad.
.055 (1.40) centered
Location for Sense (Potential) Connection:
General Information for T*e CC - Style FC and Style WB - Chip Resistors
Solder attachment note:
Style FC has a bare ceramic back surface. The recommended solders for flip chip
solder attachment are 62Sn / 36Pb / 2Ag, 96.5Sn / 3.5Ag, or standard Sn / Ag / Cu solder alloys.
Style WB has a metallized back surface for soldering to a substrate or a heat sink. The recommended solders to be used are
62Sn / 36Pb / 2Ag, 96.5Sn / 3.5Ag, or standard Sn / Ag / Cu solder alloys.
A
DBC
Dimensions in inches and (millimeters)
is a hybrid mountable version with metallized pads for wire bonding utilizing aluminum wire and a metallized back surface for solder attachment of the back surface to a heat sinking substrate.
T*e CC Low Resistance Precision Chip Resistors
Page 2 of 2
28_IL106.1004
1717 Chicago Avenue
Riverside, California 92507-2364
Phone: (951) 788-1700
Fax: (951) 369-1151
Applications Engineering
17271 North Umpqua Hwy.
Roseburg, Oregon 97470-9422
Phone: (541) 496-0700
Fax: (541) 496-0408
e-mail: • web: www.caddock.com
For Caddock Distributors listed by country see caddock.com/contact/dist.html
© 2004 Caddock Electronics, Inc.
CADKDOC
CC1512FC Standard Resistance Values:
Tolerance CC1512FC ±1% Standard (except as noted).
CC2015FC Standard Resistance Values:
Tolerance CC2015FC ±1% Standard (except as noted).
CC2520FC Standard Resistance Values:
0.010 Ω 5%
0.015 Ω 5%
0.020 Ω 5%
0.025 Ω 5%
0.030 Ω 5%
Tolerance CC2520FC ±1% Standard (except as noted).
0.033 Ω 5%
0.040 Ω 5%
0.050 Ω 2%
0.075 Ω 2%
0.10 Ω
0.15 Ω
0.20 Ω
0.25 Ω
0.30 Ω
0.33 Ω
0.40 Ω
0.50 Ω
0.75 Ω
1.00 Ω
1.50 Ω
2.00 Ω
2.50 Ω
3.00 Ω
0.010 Ω 5%
0.015 Ω 5%
0.020 Ω 5%
0.025 Ω 5%
0.030 Ω 5%
0.033 Ω 5%
0.040 Ω 5%
0.050 Ω 2%
0.075 Ω 2%
0.10 Ω
0.15 Ω
0.20 Ω
0.25 Ω
0.30 Ω
0.33 Ω
0.40 Ω
0.50 Ω
0.75 Ω
1.00 Ω
1.50 Ω
2.00 Ω
2.50 Ω
3.00 Ω
0.020 Ω 5%
0.025 Ω 5%
0.030 Ω 5%
0.033 Ω 5%
0.040 Ω 5%
0.050 Ω 2%
0.075 Ω 2%
0.10 Ω
0.15 Ω
0.20 Ω
0.25 Ω
0.30 Ω
0.33 Ω
0.40 Ω
0.50 Ω
0.75 Ω
1.00 Ω
1.50 Ω
2.00 Ω
2.50 Ω
3.00 Ω
3.30 Ω
4.00 Ω
5.00 Ω
7.50 Ω
8.00 Ω
10.0 Ω
Custom resistance values and non-standard tolerances can be manufactured for high quantity applications. Please contact Caddock Applications Engineering.
Recommended Circuit Board Layout
(current and sense connections):
Fig. 1A: Kelvin layout recommended for values below 0.20Ω
Fig. 1B: Kelvin layout
recommended for higher resistance values.
T*e CC Low Resistance Precision Chip Resistors
Style FC - Flip Chip Version is a surface mount version with solderable pads for flip chip soldering.
Note 1: General Applications - The power rating
for general applications is based upon 0.5 sq. in. (300 mm2) of termination pad or trace area (2 oz. copper) connected to each end of the resistor. Maximum chip temperature is 150°C. Use Derating Curve to derate appropriay for the maximum ambient temperature and for the temperature limitations of the adjacent materials.
Note 2: Thermal Resistance - In High Power Applications where the circuit board
material provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of the chip resistor is useful to establish the maximum power capability of the chip resistor in the application. The film temperature is measured at the center of the
resistor element and the solder pad temperature is measured at the center of the
termination pad (point X in the recommended circuit layouts shown below). Maximum
temperature of the chip resistor (at the center of chip) should not exceed 150°C through the temperature range of the application.
Style FC Derating Curve For General Applications
3.30 Ω
4.00 Ω
5.00 Ω
7.50 Ω
8.00 Ω
10.0 Ω
3.30 Ω
4.00 Ω
5.00 Ω
7.50 Ω
8.00 Ω
10.0 Ω
S
SXXCCCXXSSCC
C = Current connection
S = Sense connection
Note: Actual width of current trace is based on magnitude of current. Point of connection should be in the area shown.
0.015
Ω0.010 ΩModelResistanceMin.Max.Power Capability InformationCC1512FCCC2015FCCC2520FC10.0 Ω0.020 Ω10.0 Ω0.020 Ω10.0 Ω0.020 Ω0.010 Ω0.025 Ω150°C0.75 WattMax. ChipTemperatureGeneral ApplicationsHigh Power ApplicationsThermal Resistance - RθJCFilm (J) to Solder Pad (C)(see note 2)22.7°C/WattPower Ratingat 70° C(see note 1)22.7°C/Watt16.0°C/Watt13.0°C/Watt11.5°C/Watt150°C150°C150°C150°CDimensions in inches and (millimeters).150 ±.007(3.81 ±.18)ABD.120 ±.007(3.05 ±.18).035 min.(0.89 min.)C.027 ±.005(.69 ±.13).250 ±.007(6.35 ±.18).200 ±.007(5.08 ±.18).065 min.(1.66 min.).032 ±.005(.81 ±.13).250 ±.007(6.35 ±.18).200 ±.007(5.08 ±.18).040 min.(1.02 min.).041 ±.004(1.04 ±.10).200 ±.007(5.08 ±.18).150 ±.007(3.81 ±.18).050 min.(1.27 min.).027 ±.003(.69 ±.08).150 ±.007(3.81 ±.18).120 ±.007(3.05 ±.18).035 min.(0.89 min.).022 ±.003(.56 ±.08)CommentsSolder Coated PadsSolderable PadsSolderable PadsSolder Coated PadsSolderable Pads0.75 Watt1.0 Watt1.5 Watts1.5 WattsA*ENT TEMPERATURE, CRATED LOAD, %
o
• Style FC - Flip Chip version for surface mount applications.
Style WB - Wire Bond version for hybrid applications with metallized back
surface for solder down heat sinking of the chip, includes bondable termination
pads to receive aluminum wire bonds.
• Thermal resistance is provided to optimize high power designs when utilizing
higher thermal conductivity circuit board substrates such as IMS or Alumina.
• Resistance range down to 0.010 ohm at ±5%, 0.050 ohm at ±2%,
and 0.10 ohm at ±1%.
• Low inductance provides excellent high frequency and pulse response.
• High pulse handling and overload capability.
• Best choice for switching power supplies, motor speed controls, and high
current sensing applications.
Page 1 of 2
28_IL106.1004
Sales and Corporate Office
1717 Chicago Avenue
Riverside, California 92507-2364
Phone: (951) 788-1700
Fax: (951) 369-1151
Applications Engineering
17271 North Umpqua Hwy.
Roseburg, Oregon 97470-9422
Phone: (541) 496-0700
Fax: (541) 496-0408
e-mail: • web: www.caddock.com
For Caddock Distributors listed by country see caddock.com/contact/dist.html
© 2004 Caddock Electronics, Inc.
CADKDOCCC 2520 FC - 0.10 - 1%T*e CCPhysical Size1512 = 0.150” x 0.120”2015 = 0.200” x 0.150”2520 = 0.250” x 0.200”Style:FC or WBResistor Value (Ω)See charts for availabilityTolerance:± 5% below 0.050Ω± 2% 0.050Ω to 0.099Ω± 1% 0.10Ω and above
Specifications:
Temperature Coefficient: TC referenced to +25°C, ΔR taken at +150°C.
0.50 ohm and above, -20 to +80 ppm/°C
0.050 ohm to 0.49 ohm, 0 to +200 ppm/°C
below 0.050 ohm, 0 to +300 ppm/°C.
Inductance: Less than 5 nH t*ical.
Load Life: 1000 hours at rated power, based upon 150°C max. chip temperature,
ΔR ± (0.5% + 0.0005 ohm).
Momentary Overload: 1.5 times rated power, for 5 seconds, ΔR ± (0.5% + 0.0005 ohm).
Operating Temperature: -55°C to +150°C.
Measurement Note: All measurements are taken using Kelvin connections per the
recommended connection locations.
Ordering
Information:
Ko signifies tape thickness and dimension
12mm0.473”AoBo7” dia.(178 mm).512” arbor hole(13mm)
Packaging information:
Style FC, flip chip resistors, are shipped with the bare
ceramic side up in the pocket, with the solderable pads fac-
ing down.
Style WB, wire bondable resistors, are shipped with the
wire bondable pads facing up in the pocket.
The illustration shows the orientation of the CC1512 and
CC2015 chip resistors in the tape. The CC2520 chip resistors
are rotated 90° from what is shown in the illustration.
0.135” (3.43mm)
Carrier Tape and pocket dimensions:Tape is 12mm Carrier Tape (8mm pitch)0.167” (4.24mm)0.037” (0.94mm)0.189” (4.80mm)Size 20150.209” (5.31mm)0.087” (2.21mm)0.271” (6.88mm)Size 25200.216” (5.49mm)0.066” (1.68mm)AoBoKoSize 1512
Full reel quantities:
1500 pieces per reel for CC1512
1000 pieces per reel for CC2015 and CC2520
Quantities of less than 250 will be shipped in tape without reel and without tape leader at the option of Caddock.
Tape dimensions and materials will be consistent with EIA-481-1. Reels will be marked with a label containing Caddock logo, part number, resistor value, tolerance, packaging date, and quantity.
CC2015WB Standard Resistance Values:
Tolerance CC2015WB ±1% Standard (except as noted).
CC2520WB Standard Resistance Values:
0.025 Ω 5%
0.030 Ω 5%
0.033 Ω 5%
0.040 Ω 5%
Tolerance CC2520WB ±1% Standard (except as noted).
0.050 Ω 2%
0.075 Ω 2%
0.10 Ω
0.15 Ω
0.20 Ω
0.25 Ω
0.30 Ω
0.33 Ω
0.40 Ω
0.50 Ω
0.75 Ω
1.00 Ω
1.50 Ω
2.00 Ω
2.50 Ω
3.00 Ω
3.30 Ω
4.00 Ω
5.00 Ω
7.50 Ω
8.00 Ω
10.0 Ω
0.020 Ω 5%
0.025 Ω 5%
0.030 Ω 5%
0.033 Ω 5%
0.040 Ω 5%
0.050 Ω 2%
0.075 Ω 2%
0.10 Ω
0.15 Ω
0.20 Ω
0.25 Ω
0.30 Ω
0.33 Ω
0.40 Ω
0.50 Ω
0.75 Ω
1.00 Ω
1.50 Ω
2.00 Ω
2.50 Ω
3.00 Ω
3.30 Ω
4.00 Ω
5.00 Ω
7.50 Ω
8.00 Ω
10.0 Ω
Custom resistance values and non-standard tolerances can be manufactured for high quantity applications. Please contact Caddock Applications Engineering.
Style WB - Wire Bond Version
Model
ResistanceMin.Max.Power Capability InformationCC2015WBCC2520WB10.0 Ω10.0 Ω0.020 Ω0.025 ΩMax. ChipTemperatureThermal ResistanceRθJCFilm (J) to Solder Pad (C)(see note 3)13.9°C/Watt8.33°C/Watt150°C150°CDimensions in inches and (millimeters)ABDC.250 ±.007(6.35 ±.18).200 ±.007(5.08 ±.18).040 min.(1.02 min.).200 ±.007(5.08 ±.18).150 ±.007(3.81 ±.18).050 min.(1.27 min.).027 ±.003(.69 ±.08)CommentsAluminum wire to be used for bonding.027 ±.003(.69 ±.08)Aluminum wire to be used for bonding
Note 3: Thermal Resistance - In High Power Applications where the circuit board material provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of the chip resistor is useful to establish the maximum power capability of the chip resistor in the application. The film temperature is measured at the center of the resistor element and the solder pad temperature is measured at the soldered interface with the circuit board. Maximum temperature of the chip resistor (at the center of chip) should not exceed 150°C through the temperature range of the application.WB Resistor mountingCircuit board: IMS, Ceramic (Alumina) , or other.Sense WireCurrent WireFilm TemperatureMeasuring PointSolder pad, solderedinterface with circuit board.Sense WireCurrent Wire
Sense connection shall be made in the crosshatched portion of the termination
pad.
.055 (1.40) centered
Location for Sense (Potential) Connection:
General Information for T*e CC - Style FC and Style WB - Chip Resistors
Solder attachment note:
Style FC has a bare ceramic back surface. The recommended solders for flip chip
solder attachment are 62Sn / 36Pb / 2Ag, 96.5Sn / 3.5Ag, or standard Sn / Ag / Cu solder alloys.
Style WB has a metallized back surface for soldering to a substrate or a heat sink. The recommended solders to be used are
62Sn / 36Pb / 2Ag, 96.5Sn / 3.5Ag, or standard Sn / Ag / Cu solder alloys.
A
DBC
Dimensions in inches and (millimeters)
is a hybrid mountable version with metallized pads for wire bonding utilizing aluminum wire and a metallized back surface for solder attachment of the back surface to a heat sinking substrate.
T*e CC Low Resistance Precision Chip Resistors
Page 2 of 2
28_IL106.1004